COOLSERVER P42 4U 6 Heatpipe CPU Cooler 250W 4pin PWM Fan Radiator Workstation/Server Heatsink For AMD SP3 Motherboard

Other / NO RGB

$78.99 $81.99

COOLSERVER P42 4U 6 Heatpipe CPU Cooler 250W 4pin PWM Fan Radiator Workstation/Server Heatsink For AMD SP3 Motherboard

$78.99 $81.99

SPECIFICATIONS

Air Volume: 23-89 CFM

Blade Quantity: 7

Brand Name: COOLSERVER

Certification: CE,RoHS

Choice: yes

Cooler Type: Tower

Fan Life: 50000 hrs

Fan Size: 92x92x25mm

Fan Speed: 1200 - 2800

High-concerned chemical: None

Lines: 4 LINES

Model Number: P42

Noise: 26dBA

Origin: Mainland China

Package: Yes

Power Interface: 4PIN

Series: P42

Supported CPU: Onboard CPU

TDP: 280

semi_Choice: yes

AMD SP3-4U P42 specifications

Product model: AMD SP3 4U-P42
CPU type: AMD SP3 (rectangular motherboard)
Voltage: 12V
Product size: 120mm*92.5mm*125.4mm
Fan speed: PWM 1900-3800RPM
Noise value: 44dBA (MAX)
Air volume: 61.46CFM (MAX)
Fan plug: 4pin PWM
Bearing type: double ball
Number of copper tubes: 6
Power consumption: 280W
Material quality: copper base + aluminum fins + 6 heat pipes

Using 6 composite heat pipes

Stronger thermal conductivity, better excellent thermal conductivity and heat dissipation performance

6 high-efficiency heat pipes closely cover the surface of the CPU, which greatly increases the contact area and allows the heat to be conducted to the cooling fins more efficiently.

Heat Pipe Nickel Plating Process

The 6 composite heat pipes are designed with nickel-plated surface treatment to increase the contact between the magnesium light and the inside of the anti-oxidation heat pipe, effectively improving the heat conduction efficiency of the heat pipe.

Adopt 9225 fan

Imported Ic original device, quiet, stable, strong wind, large air volume, fast and efficient heat dissipation

The unique fan blade design can effectively reduce the wind shear sound produced by the fan blade.

Reflow soldering process

Better contact, stable thermal conductivity, high heat conversion rate, and efficient heat dissipation

The heat-conducting copper tube and the base adopt the reflow soldering process. The high-precision and tight bonding, the solder is full, and the workmanship is fine, which improves the heat conduction efficiency of the CPU to the cooling fins.

Aluminum fin cooling module

The design of the conjoined heat dissipation group using pure aluminum material can directly dissipate part of the temperature, which greatly improves the heat dissipation efficiency.

The fins on both sides of the heat sink can not only increase the firmness, but also maintain the same spacing between each fin, so that the generated airflow can pass through each fin evenly and smoothly, thereby enhancing the heat dissipation performance.

Nickel plated cooling fins

Using 0.3mm thick aluminum heat dissipation fins, the brocade plating process increases the appearance and the structure design of multi-layer penetration resistance of oxidative airflow to reduce airflow loss.

Copper bottom conducts heat quickly

The zero-distance contact of the copper bottom is conducive to the heat generated by the CPU to be conducted to the surrounding at the first time
Fits the CPU heating core, absorbs and conducts every heat in time

Aluminum Electroless Nickel Plating Technology

1. The metal surface treated by this process is an amorphous coating with excellent corrosion resistance
2. Since the surface after catalytic treatment is amorphous, that is, it is in a basic plane state and has self-lubricating properties, so the friction coefficient is small, the non-adhesion is good, and the wear resistance is high.
3. After the chemical brocade treatment, the hardness of the metal surface can be more than doubled
4. The bonding strength between the alloy layer and the metal base after chemical brocade treatment increases, generally under the condition of 350-400Mpa, it will not peel, fall off, and have no bubbles, and the bonding strength with aluminum can reach 102-241Mpa.